AGI, Abbie Gregg, Inc. | Cleanroom Consultants | Semiconductors, FPD, Nano, MEMS, Bio

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staff biographies

MS - Vice President, Operations and Engineering

MAJOR INTEREST AND SKILLS
Semiconductor operations, facilities, process/device engineering, production, maintenance, production planning and control in wafer fab, test, and assembly operation. Operations, cost, and capacity modeling development and analysis. FPD processing and tool installations. Multi-cultural environments in Asian and European companies. Submicron geometries/process upgrades.

EXPERIENCE
Over twenty years of diverse experience in semiconductor operations and engineering. Consulting experience includes FPD, semiconductors including III-V materials, flexible backplanes, nanotechnology and photovoltaic clients. Factory modeling, tool installations, operations planning, cleanroom design, construction consulting, development and implementation of factory expansion plans, technology transfer, and insurance forensics have been performed for clients such as UC Berkeley, UC Riverside, Duke University, Yale University, Raytheon, Littelfuse, USDC, ASU Flexible Display Center, Perkin Elmer, Hologic, Skyworks Solutions, Inc. and others.

Operations, cost, and capacity modeling development and analysis; including software development for AGI’s Jupiter© [Detailed Factory / Product], CARME© [High Level Operational / Financial], Pluto© [Mid Level Operational / Financial] and eValuate© [Cost of Ownership]. Models developed for semiconductor, FPD, flexible electronics, solar cell, touch screen, and hybrid device applications.

Roll to roll manufacturing experience including development of cost and capacity model for the USDC and creation of a benchmark for roll to roll manufacturing of electronic devices. Has given multiple presentations on roll to roll manufacturing of flexible electronics at USDC and AIMCAL conferences.

Prior to AGI, as Vice President of Operations at Primarion, was responsible for the local 4” bipolar wafer fab facility and the foundry fab, test, and assembly operations in a pre-IPO company. Departments include production, engineering, maintenance, facilities, planning, production control, quality, shipping and receiving. Improved fab financial performance from negative to positive EBITDA through cost controls, using cost and revenue modeling, and operating efficiency improvements. Implemented manufacturing planning, cost, and scheduling systems to develop a ‘plan of record’ for use in parallel to bringing up an ERP system. Set up systems to monitor and control vendor supply chain performance.

At Hyundai, as Vice President of Manufacturing, was seventh employee hired for a Greenfield start-up of 8”, 0.28 micron 64M DRAM fab. Involved in all phases of start-up including construction, regulatory agencies, policies, environmental, recruiting. Successful start-up taking only seven months from first engineering wafer starts to 1,000 production starts per day.

Other previous experience includes Director of Electrical Wafer Sort, Final Test and Burn-in, and Director of Facilities at ST Microelectronics. Ramped EWS area through a five fold increase in 8” wafers per week in 1 year.

Tripled output per direct labor hour. Improved operational efficiency in area from <60% to >90% in 1 year. Cost justified and ordered successful high-speed electrical back-up system to reduce power problems.

At Hitachi, as Facilities Director and Senior Operations Manager, completed the following: Continuous remodel and relayout to add $30M in equipment per year in five sites with 350k square feet. Management of around the clock operation shipping 2,000,000 units per month with $150M annual revenue. Improved overall manufacturing productivity by 10% every 6 months. Started first Hitachi SIMM module assembly area outside of Japan.

Also experienced as Operations Manager MOS and Bipolar Test, MOS Wafer Fabrication Manager, and Engineering Manager, Supervisor of Advanced Process Development Group, Device Engineering Manager, Senior Product Engineer, and Senior Diffusion Engineer while at Motorola, AMI, GI and Honeywell. Held secret clearance at Honeywell as part of set up of an in-house ‘secret’ level test area.

EDUCATION
BS Chemical Engineering, Magna Cum Laude, Arizona State University
Engineering Training Program at Motorola