also see our staff
bios
recent projects
AGI
Industrial Wafer Fabrication Projects
Project /
Location / Date
|
Scope of Work
|
|
|
|
|
ForCon 2003 – 2005 |
•
Process Equipment Damage Analysis •
Fair Market Valuation of Damaged Tools •
Develop Tool Repair Roadmap and Alternatives |
Motorola
1995, 1998, 2003 |
•
Bipolar 100mm, 150mm Wafers, 200mm Wafers •
Site Renovation Plans •
Fab Consolidation, Wafer Size Increases •
Phased Layout Scenarios |
|
Fujitsu 2002 |
•
200mm Memory Fab site •
Factory/Capacity and Cost Model •
Assist with |
|
Hynix Semiconductor 2002 |
•
Multi Fab Audit •
Benchmark Wafer Costs •
300mm Wafer Fab Strategy •
DRAM Technology Integration Plan to 0.13 Micron •
Multi Fab Analysis |
|
Medtronic 2002 |
•
Wafer Fab Capital Spending Plan •
Tool Recommendations |
|
•
Two-Four Fab 300mm Wafer Processing Site •
Analysis of Wafer Fab Requirements •
Advanced Microprocessors or Memories •
Unique 1000 acre Green Site •
Verification that planned fab capabilities and design would
meet the needs of the 3 largest Wafer Fabrication companies in the world •
Successfully Attracted and Sited Wafer Fabrication Facilities •
Economic Development and
Incentives Modeling •
Vibration, RF, EMI and
Acoustic Site Survey •
Environmental impact
evaluation •
Community Education
Activities •
Competitive $1.2 Billion
Incentives |
Philips Semiconductors
1999 – 2002 |
•
BiCMOS, 0.25 to 0.18
Micron, 200mm Wafer Fab, SMIF •
75,000 Square Foot Renovation, including CMP Area •
Utility Matrix, Equipment and Room Layouts •
Vibration Analysis, Engineering Review, and Automation Plan |
Silterra, for
|
•
Awarded Top Fabs of 202 by Semiconductor
International Magazine, May 2002 •
Green Site •
Advanced CMOS, 200mm wafer fab, SMIF, 0.18 Micron •
Class 1 to Class 1,000 Environ •
Fan Deck, Cleanroom Raised Floor, Ballroom, Subfab •
Copper and CMP Processes •
Test and Failure Analysis •
Layout Develop •
Capacity Analysis •
Utility Matrix, Tool Comparison, HPM Analysis •
Automation Review •
Base Build Consulting Support •
EMI Evaluation for Characterization Areas |
|
Littelfuse 1996 – 2002 |
•
Thin film fuses. •
Manufacturing Technology. •
Wafer fab and Gas discharge. •
TVS acquisition evaluation. •
Technology Transfer •
Foundry Search and Evaluation |
|
2001 – 2002 |
•
Microelectronics Cleanroom •
Renovation •
Programming •
Layout •
Utility Matrix •
Tool Relocation from •
Detail Design •
Construction Support |
|
Knowles 2001 |
•
Bipolar Wafer Fab •
Wafer Fab Maintenance and Equipment Engineering •
Process Setup •
•
Assistance with Technology Transfer/Outsource |
|
Primarion 2001 |
•
Bipolar/BiCMOS/Discrete Fab •
Fair Market Valuation •
Benchmark Fab Sales |
|
Atmel 2000 – 2001 |
•
Operating •
137,000 square foot Cleanroom •
Site Evaluations to accommodate 0.18 micron process •
Class 1 to Class 1,000 •
Multi Level Fab, 2 Subfab Levels,
Fan Deck, Ballroom •
Layout for 200mm Tools •
Utility Matrix •
Room Condition Evaluation •
Capacity Analysis •
HPM Analysis |
|
Micron Technology 2000 - 2001 |
•
300mm Wafer Fab DRAM •
Industrial Engineering •
Layout •
Utility Matrix •
Capacity Study / Site Studies |
Motorola
1997 – 2001 |
•
Advanced CMOS, 200mm wafer fab, 0.35 Micron •
Equipment Maintenance:
Thin films, Ion Implant, CVD, Metrology. |
Confidential Client 2000 |
•
Bay/Chase vs. Ballroom Tool Layout Studies for 200mm and 300mm
tool sets. |
|
Sarnoff 2000 |
•
Custom IC Fab •
Equipment/Process Analysis and Recommendations |
|
FlipChip Technologies 1996, 2000 |
•
Bump Fab: 4”, 6”, 200mm Wafers •
Bottleneck Analysis/Modeling •
Cycle Time Improvement •
Tool Rigging, Wall Configuration, Tool Positioning, Fit-up |
|
Ericsson Components 1996 – 1999 |
•
BIPOLAR, BiCMOS, CMOS wafer fabs, 0.35 Micron •
Evaluate 150mm conversion of existing wafer fabs. •
Layout optimization. •
Utility matrix development. •
Process optimization and operations turnaround. •
Extensive factory modeling for product mix changes. •
Equip |
|
Texas Instruments, formerly Unitrode 1997 –2000 |
•
150mm BiCMOS Fab start-up, 0.6
Micron •
Fab start-up, Operations Management and Process Qualification. •
Tool installation and acceptance. •
Wafer process start-up, specification and process development. •
Etch, Diffusion, CVD, Multi level
metal. •
Consult on 100mm to 150mm conversion of Bipolar Fab. |
|
Advanced Micro Devices 1994 – 2000 |
•
Advanced
CMOS microprocessors, Logic •
Course
development and training:
Parametric Testing, Basic Electronics, Wafer Reliability, Semiconductor
Physics and Wafer Sort, Class rating 4.8/5. •
Multiple
fabs / site training support |
|
GMT Microelectronics 1993 – 2000 |
•
Silicon
wafer foundry. •
Business
plan development and market analysis . •
Process
equipment maintenance. |
|
1997 – 1999 |
•
LCD Microdisplay on 200mm wafers. •
Consult on process and automation of wafer and glass based FPD
manufacturing, including wafer foundry and LCD assembly process. •
Consult on manufacturing strategies and management. |
|
White Oak Semiconductor/DPR 1996 |
•
200mm
wafer fab. •
Review
of Conceptual Design. |
|
Kopin Corporation 1996 |
•
Miniature
Transmissive Color LCD. •
Color
filter process development, transfer to wafer fab foundry and production
validation, including tool and cleanroom setup. |
|
LSI Logic 1995 |
•
200mm Green Site CMOS Wafer Fab •
Layout – SMIF Fab •
Utility Matrix •
Programming, Capacity Analysis, Modeling |