also see our staff
bios
recent projects
AGI
Test, Assembly and Packaging Projects
Project
/ Location / Date
|
Scope
of Work
|
|
|
|
|
Confidential Client 2005 – 2006 |
MEMS Display Start Up Consulting • Facility/Tool
Install Design Review • Documentation and
training of Fab and Assembly Processes, Facilities, Environmental Health and
Safety, and Cleanroom Protocol • Acceptance testing
of process equipment • Development of
materials and supplies requirements • Capacity Modeling,
Front End / Back End – with Unique Assembly Algorithms |
|
RPO Party, Ltd. 2006-08 |
Flexible Substrate Design
for Assembly •
Touch Screen System for Electronics Consumer Product
Application •
Development of Design Rule Specifications, Dicing Arrangement
and Assembly Approach |
|
UltraScan, Corp. 2006-08 |
Advanced Biometric
Sensor Assembly •
Biometric security application based on novel technology •
Identification of potential vendors for product
development and manufacturing •
Assembly and testing of TFT,
Chip on Flex and PC Board •
Studies to optimize assembly configuration and costs |
Amkor
2000 |
•
High Volume Assembly
and BGA Renovation •
Layout and Utility Matrix Consulting •
Utility Distribution Analysis |
|
Kodak 1998 |
•
OLED Displays •
Equipment and Industrial Engineering support for new
robotic encapsulation system – development and installation |
|
Integrated
Circuit Systems, Inc. (formerly MNC,
Andersen Labs) 1997-98 |
•
Hybrids, Thin and
Thick Film, SAW Devices •
Process Analysis and Improvements •
Technical Valuation of a Potential Acquisition •
Surface Acoustic Wave and Hi-Rel
Hybrid Operations Analysis |
|
Electroglas 1996-98 |
•
Market and Technology evaluations for successful
acquisitions •
Yield Management Software (Knights) •
Assembly and Bump Inspection Systems (Techne’) •
Sort Floor Operations Inspection market evaluation |
|
1997 |
•
LCD Microdisplay. •
Consult on process and automation of wafer and glass
based FPD manufacturing, including wafer foundry
and LCD assembly process. •
Consult on manufacturing strategies and management. |
|
Littelfuse 1996-97 |
•
Thin film fuses, USB Switch, TVS device •
Manufacturing Technology analysis •
Wafer fab, assembly, test and Gas discharge TVS
acquisition evaluation •
Product development plan, cost model-USB switch |
|
FlipChip
Technologies 1996-97 |
•
Bump Wafer Fab •
Tool rigging, wall reconfiguration, tool positioning,
and fit up |
|
Scitex Digital Printing 1996-97 |
•
Digital print heads (high speed) •
Process analysis, process tool selection and evaluation •
Layout review •
Conceptual design strategy |
|
Reedholm
Instruments 1995 |
•
Test equipment •
Wafer level reliability •
Equipment marketing |
|
Advanced
Micro Devices 1994 |
•
Advanced CMOS microprocessors,
Logic •
Course development and training: Parametric Testing, Basic Electronics,
Wafer Reliability, Semiconductor Physics and Wafer Sort, Class rating 4.8/5 •
Multiple fabs / site training
support |
Medtronic/Microrel
1992-94 |
•
Medical, Implantable Hybrids (Pacemakers) •
Start up of Tachy
Manufacturing Line (Hybrid Assembly and Test) •
Renovation/validation, Process Equipment Engineering •
FDA Auditable •
Hybrid Design rule Development |
|
General
Semiconductor Industries, Inc. 1991-92 |
•
Transient Voltage Suppression Devices – Wafers,
Modules, MOV’s, Assembly, Test •
Technical Operations Management o
Process, device, product, and equipment engineering, strategic
technology development, quality and reliability (MIL STD, ISO 9000) o
Successful turnaround / sale of company o
First DESC qualified line
outside of |
|
Delco Electronics/
Bump Fab 1990-91 |
•
Bump wafers – Automotive •
Bump Fab Phased Renovation of existing fab •
Conceptual design, layout, utility matrix •
Phase planning, management presentation |
AIL Systems
Division of Eaton 1990-91 |
•
Hi-Rel Hybrids, SAW devices,
Si and GaAs wafers •
Campus Consolidation of Fab, Assembly, and Test for Hi-Rel Devices and Hybrids |
Aerojet
1989 |
•
GaAs/Si Military Fab,
Assembly, Test |
|
I-Stat Corp. Princeton, NJ Kanata, Ontario,
Canada 1987-90 |
•
Medical Sensor Fab, R&D, Assembly •
Building acquisition and complete renovation of 100mm
wafer fab, assembly and test |
|
Engelhard
Millis Corp. 1986 |
•
Hybrid Fab |
|
VLSI Technology, Inc. 1986-87 |
•
IC Assembly, Test, Burn-In, QA •
Layout, utility matrix, design consultation,
construction consultation |
|
Grumman
Space Systems 1989 |
•
SDI Focal Plane Array •
HgCdTe, CMOS, Hybrid Technology •
Manufacturing Cost Model |
|
Lasercom 1987 |
•
InP Laser Fab, Assy Test •
Process Specification Development •
Yield Enhancement |