also see our staff
bios
recent projects
AGI
Industrial Start Up Projects
Project / Location
|
Date
|
Scope of Work
|
|
|
|
|
Confidential Client
|
2005 – 2006 |
MEMS Display Start Up Consulting •
Facility/Tool Install Design Review •
Documentation and training of Fab and Assembly Processes, Facilities,
Environmental Health and Safety, and Cleanroom Protocol. •
Acceptance testing of process equipment. •
Development of materials and supplies requirements. •
Capacity Modeling, Front End / Back End |
Power Paper, Ltd.
Confidential Location |
2005 – 2006 |
Manufacturability Study of Roll to Roll Process •
Flexible Electronic Product •
New Technology and Process Evaluation •
Review of Worldwide License Capabilities. |
Mohawk Valley EDGE
|
2004 – Present |
Large Chip Fab Site •
Site Evaluation – Vibration / EMI / Traffic •
Optimize Site Layout •
Market Site to IC Manufacturers •
Wetlands Permit / Abatement Consulting •
Develop Local Support and Infrastructure |
|
2002 – Present |
Industry Requirements & Environmental Impact Study
Report •
300mm Wafer Fab Benchmark Study to accommodate 4 fabs •
1000 Acre site for World’s Largest IC Manufacturers. •
Site Survey (EMI, Vibration, RF, Acoustic) •
Due Diligence Evaluation •
VIP and Community Education |
N-trig, Ltd.
|
2003 |
Magnetic Digitizer – Flexible Electronics •
Start-up Support •
Process Analysis •
Assist with the Commercialization of New Technology •
Device Cross Section |
Motorola Life Sciences
|
2001 – 2002 |
Bio Safety Lab (BLSII/III) Design and Construction •
Biochip Lab and Manufacturing Cleanroom Expansion •
Relocation Project Planning •
Tool List, CAD Footprints •
Utility Matrix |
Rockwell Collins
|
2001 |
LCD Fab •
Renovation •
Programming, Design, Budgeting, Layout, Utility Matrix |
Citala
|
2001 |
New Flexible Display Fab •
Roll to Roll Processing •
Programming, Layout •
Tool Analysis •
Process Analysis |
Atmel
|
2001 |
Operating •
137,000 square foot Cleanroom •
Site Evaluations to accommodate 0.18 micron process •
Class 1 to Class 1,000 •
Multi Level Fab, 2 Subfab Levels,
Fan Deck, Ballroom •
Layout for 200mm Tools •
Utility Matrix •
Room Condition Evaluation •
Capacity Analysis •
HPM Analysis |
Micron Technologies
|
2000 – 2001 |
300mm Wafer Fab •
Industrial Engineering •
Layout •
Utility Matrix •
Capacity Study |
Amkor
|
2000 |
High Volume Assembly and BGA Renovation •
Layout and Utility Matrix Consulting •
Utility Distribution Analysis |
Philips Semiconductors
|
1999 – 2002 |
Operating Fab – Complete, Phased Renovation •
BiCMOS, 0.25 to 0.18
Micron, 150mm and 200mm Wafer Fabs •
SMIF Introduction •
75,000 Square Foot Renovation, including CMP Area •
Class 10 to Class 1,000 •
Utility Matrix, Equipment and Room Layouts •
Vibration Analysis, Engineering Review, and Automation Plan •
Base Build Consulting Support •
HPM Analysis |
Silterra
(fka Wafer Technology)
|
1998 – 2002 |
Green Build Advanced •
Awarded Top Fabs of 2002 by Semiconductor
International Magazine, May 2002 •
Class 1 to Class 1,000 Environment •
Fan Deck, Cleanroom Raised Floor, Ballroom, Subfab •
Copper and CMP Processes •
Test and Failure Analysis •
Layout Development/Optimization •
Capacity Analysis •
Utility Matrix, Tool Comparison, HPM Analysis •
Automation Review •
Base Build Consulting Support •
EMI Evaluation for Characterization Areas |
Siemens / Uniax
|
1998 |
New OLED Manufacturing Process On Generation 2 Substrate •
Manufacturing Process Feasibility Study •
Cost analysis of current and proposed manufacturing processes •
Cost modeling of Start-Up over 5 year horizon |
|
1997-2000 |
150mm BiCMOS Wafers •
Fab Start-Up and Qualification •
Tool installation and acceptance •
Wafer process start-up, specifications and process development •
Etch, Diffusion, CVD |
|
FlipChip Technologies |
1996-1997 |
Bump Wafer Fab •
Tool Rigging •
Wall Reconfiguration •
Tool Positioning and Fit Up |
|
Scitex
Digital Printing |
1996-1997 |
Digital Print Heads (High Speed) •
Process analysis, process tool selection and evaluation •
Layout review •
Conceptual design strategy |
|
White Oak
Semiconductor/DPR VA |
1996 |
200mm Wafer Fab •
Review of Conceptual Design |
|
Eastman Kodak |
1995 – 2006 |
OLED FPD Pilot Line •
Factory analysis, cost model, equipment specification, equipment
procurement, layout, facility design and construction. Engineering support
for R&D and pilot line facility.
Fit up support. •
Process specification development and outsourcing. •
Site selection factory model, conceptual design for pilot line
scale-up. •
Color filter technology, process
& cost analysis. •
Ongoing Process Engineering and Technology Transfer Support. |
|
Microchip
Technology |
1995 |
200mm Wafer Submicron •
Fab Layout •
Potential fab acquisition evaluation in |
Motorola
|
1995 |
Bipolar 100mm, 150mm Wafers •
Site Renovation Plan |
LSI Logic/ATA
|
1995 |
200mm •
SMIF Wafer Fab Layout •
Capacity Analysis •
Modeling, Simulation, Automation and Utility Consulting |
|
Hewlett Packard/IDC |
1993 |
200mm •
Hi-Thruput Fab Facility •
Conceptual design, Mini-Environment,
Automation, Layout, Utilities |
|
OIS Optical Imaging Systems, Inc. |
1992 – 1996 |
AMLCD Pilot Demonstration Facility •
First in the •
Conceptual Design, Bid Specs, Layout, Construction
Management, Fit-Up design and supervision. •
Material Handling System Design – Front opening
unified pod with minienvironment (KPODÔ). |
Medtronic/Microrel
|
1992 – 1994 |
Medical, Implantable Hybrids (Pacemakers) •
Start up of Tachy
Manufacturing Line •
Renovation/validation, Process Equipment Engineering •
FDA Auditable •
Hybrid Design rule, Development |
|
Delco Electronics/ Bump Fab |
1990-1991 |
Bump wafers – Automotive •
Bump Fab Phased Renovation of existing fab •
Conceptual design, layout, utility matrix •
Phase planning, management presentation |
AIL Systems
Division of Eaton |
1990-1991 |
Hi-Rel Hybrids, SAW Devices,
Si and GaAs Wafers •
Campus Consolidation of Fab, Assembly, and Test for Hi-Rel Devices and Hybrids. |
Aerojet
|
1989 |
•
GaAs/Si Military Fab,
Assembly, Test. |
|
ULVAC |
1989 |
•
Equipment Demo Lab. |
|
GE Aerospace |
1988 |
• |