also see our staff
bios
recent projects
Project /
Location
|
Scope of Work
|
|
|
|
|
RPO Pty,
Ltd. 2006 |
Capacity
and Cost Modeling •
Flexible Touch Screen System for Consumer Electronics
Application |
|
Confidential
Client 2005-2006 |
Capacity
and Cost Modeling •
MEMS Display Process and Product Mix Modeling for Develop |
|
2004 – 2006 |
Fab
Site Location – Net Present Cost Model •
Compared world-wide locations of 300mm fab sites •
Evaluated impact of incentives including tax abate •
Modeled specific sites for potential clients |
|
2003-2005 |
ASU
Flexible •
Joint venture between Army Research Labs, •
Established need for modeling of flexible display backplane
costs based on previous modeling for USDC, Army and Industry needs for
flexible backplane foundry •
Established tool cost model for 6 inch wafer tools and Gen 2
substrate tools •
Developed cost and pricing plan to support University
business model for multi-user Cleanroom and Company Headquarters
type facility •
Developed plan for flexible display cost model with 5 to 10
year horizon to support Army program and future foundry for flexible displays |
|
at 2003-2005 |
Bourns
Hall Nanotechnology Cleanroom and •
Developed CARME operational cost model for University
nanotechnology cleanroom and FIB area •
Balanced cost and recharge rates over 5 year outlook for
establishing cleanroom user and staff growth •
Benchmarked other UC Cleanroom cost and charge-out rates •
Established key tool vendor negotiations to capitalize
maintenance and warranty costs to alleviate operating costs. |
|
2003-2004 |
CIEMAS Cleanroom (Center for Interdisciplinary Engineering
and Medical Applied Sciences) •
Developed CARME operational cost model for University
cleanroom and characterization areas. •
Includes facility base usage charge, special tool charge and
personnel services charges •
Benchmarked other shared user facilities |
|
US Display
Consortium 2005 – 2006 |
Roll-to-Roll Manufacturing Cost Model for Flexible
Displays •
Update 2003 study including current industry information on
Process Flows, Tools and Materials |
|
US Display
Consortium 2002 – 2003 |
Roll-to-Roll Manufacturing Cost Model for Flexible
Displays •
Cost model includes equip o
Process types and their associated capabilities in terms of
device di o
Roll-to-Roll tool and handling characteristics important to o
Tool and equip o
Possible factory layouts and tool groupings for flexible
substrate processing, using roll-to-roll processes where possible o
Estimated cleanliness in terms of clean class and local minienviron o
Estimated cost to create a roll to roll factory for flexible
displays with the para |
|
US Display
Consortium 1998 |
Horizontal
vs. Vertical Flat Panel Processing Study •
Cost analysis of transition to
vertical material handling. •
Cost modeling of transition from
generation 3.5 to generation 5 substrates utilizing |
|
US Display
Consortium |
Com •
Develop •
Validation of AMLCD and •
Includes plate matching analysis. |
|
US Display
Consortium 1994 - 2002 |
•
12.1” AMLCD Notebook Display •
Web Based Processing Team Member •
Glass Edge Chipping Equip •
RFP generation and tool port plate height study. •
Participant in material handling worldwide Benchmarking study. •
Developed Cost of Ownership Seminar for FPD division of |
DuPont Displays
2003 |
•
Cost Model for Flexible Displays |
Raytheon
2002 |
•
Optical Phased Array – 100mm Substrate FPD/IC Process. •
Low Volume Factory Model/Cost Analysis. •
Operations Relocation Consulting. •
Site Selection Analysis |
Fujitsu
2002 |
•
200mm •
Assist with sale of US fab •
Create Capacity/Cost Model for Alternate buyer scenarios. |
Citala
2001 |
•
New Flexible Display Fab •
Roll to Roll Processing •
Automation Analysis •
Programming, Layout, Utility Matrix •
Tool Analysis and Selection •
Process Analysis •
Cost/Factory Model •
Benchmark Display Costs |
|
Dow Chemical 2001 |
•
Display Technology Evaluation •
Cost Model •
Equipment Analysis and Recommendations •
Process Analysis |
|
Display
Sciences 2000-2001 |
•
MEMS Display •
Factory and Cost Model •
Software Instruction/Sale |
|
Sandia
National Labs 2000-2001 |
•
Wafer Fab Expansion and Renovation •
FabTech© Utility
Matrix, Delta Studies •
Tool Research •
Software Instruction/Sale |
|
Motorola BioChip 2000-2002 |
•
BioChip Pilot Line Scale up •
Management of Scale up and move •
FabTech© Utility Matrix
for Lab and Production Areas |
|
IPC -
Printed Circuit Board Conference 2001 |
•
Cost of Ownership Class •
eValuate© Model |
|
Arima – Broadband Semiconductor 2000 |
•
GaAs 6” Wafer Fab •
Jupiter© Factory Cost
Model •
FabTech© Utility
Matrix •
Fab Layout •
Software Instruction |
|
At 2000 |
•
200 mm Wafer Fab, Multibuilding
Renovation •
FabTech© Utility
Matrix, Correlated to Phased Layout •
Jupiter© Capacity
Model •
Software Instruction/Sales |
|
Amkor / Sie North 2000 |
•
200 mm Wafer Fab •
Technical Evaluation •
Jupiter© Factory
Model, Moves Matrix, Capacity Scenarios and Analysis |
|
Matsushita
Corporation of 2000 |
•
200mm Wafer Fab – Multibuilding Site •
Jupiter© Factory Model,
Capacity Analysis, Moves Matrix •
Support of Facility Marketing |
|
3M 1999-2001 |
•
Jupiter© Factory Cost
and Capacity Model •
Rigorous static model for tool set
determination, fab capacity and start-up cost. •
Comparative product cost model for
display technologies. |
|
Silterra 1998-2000 |
•
200mm SMIF wafer fab design •
Utility matrix development and analysis of proposed process
equipment for facility design purposes (FabTech©). •
Static capacity modeling for tool set determination and
verification (Jupiter©). |
|
Philips
Semiconductor 1999-2001 |
•
200mm SMIF wafer fab retrofit. •
Utility matrix development and analysis of proposed process equipment
for facility design purposes (FabTech©). |
|
Littelfuse |