also see our staff
bios
recent projects
Project /
Location / Date
|
Scope of Work
|
|
|
|
|
Solid State Equipment
Corp. 2006 |
MEMS Process
Consulting •
Double Sided MEMS Device Processing •
Coat process/Tool Optimization •
Equipment Acceptance Testing |
|
Confidential Client 2005 – 2006 |
MEMS Display Start Up
Consulting •
Facility/Tool Install Design Review •
Documentation and training of Fab and Assembly Processes,
Facilities, Environmental Health and Safety, and Cleanroom Protocol •
Acceptance testing of process equipment •
Development of materials and supplies requirements •
Capacity Modeling, Front End / Back End |
|
2002 – 2005 |
Center for Nanoscale Science and Engineering (CNSE) Renovation •
Class 100 and Class 1,000
Nanotechnology Cleanroom •
Characterization Area and E-Beam
Lithography •
Remodel and Upgrade of Facilities
Support Areas •
Cleanroom and Characterization
Programming •
Design and Construction Support
(Design-Build Project) •
Site and Facilities Survey •
Layout, Utility Matrix, HPM Analysis •
Permitting Support •
Tool Research and Negotiation •
Vibration and EMI Consulting and
Abate •
Operational Financial Modeling for
the Center •
Process Engineering Support for the
Tool Evaluation, Acceptance and Start-up |
|
2003 – Present |
•
Class 10 to Class 1000 Areas for CMOS, MEMS, GaAs, Organics •
As Built of Existing Cleanroom •
Cleanroom Design: Programming through Construction Documents •
Value Engineering •
Layout and Utility Matrix Development •
Tool Research •
HPM Analysis and Specialty Systems Consulting •
HVAC Design and Code Evaluations •
E-Beam Litho, MOCVD and MBE |
|
2002 – 2004 |
•
Class 100 to 1,000 Areas on Two Levels •
Cleanroom Design: Programming through Construction Documents
and Bid Packages •
Value Engineering •
Layout and Utility Matrix Development •
Tool Research •
HPM Analysis and Specialty Systems Design •
Vibration and EMI Consulting •
LEEDTM Design •
MOCVD, Maskmaking, and
Characterization |
|
Infotonics 2001 – 2003 |
Optical MEMS Joint
Venture – Xerox, Kodak, •
MEMS Cleanroom •
Packaging Cleanroom •
Project Plan/Project Outline •
Programming •
Tool List Development/Analysis •
Layout, Phasing Analysis •
Utility Matrix •
Preliminary Budgeting •
Retrofit Consulting •
HPM Analysis •
HVAC Consulting |
|
Amersham 2002 |
BioMEMS Device Fab
Renovation •
Layout of new Class 1,000 to 10,000 BioChip
Process Areas |
|
Motorola Biochip 2000 – 2002 |
Bio Safety Lab
(BLSII/III) Design and Construction •
Biochip Lab and Manufacturing Cleanroom Expansion •
Relocation Project Planning •
Project Management •
Tool List, CAD Footprints •
Utility Matrix •
Specification Development |
|
MEMSolutions 1999 – 2002 |
MEMS Display
Development, Pilot Line •
Process Development and Optimization •
Process Engineering and Equipment Maintenance |
|
Knowles 2001 |
Hearing Aid and Microphone Manufacturing •
Bipolar Wafer Fab •
Wafer Fab Maintenance and Equipment Engineering •
Process Setup •
•
Assistance with Technology Transfer/Outsource |
|
MicroLab 2001 |
MEMS Startup •
Facility Consulting – Cleanroom •
Site Selection |
|
Sandia National Labs 2000 – 2001, 2006 |
•
Compound Semiconductor, MEMS, and Silicon CMOS •
Si and III – V Fab •
Expansion and Relocation •
Layout Analysis, Utility Matrix •
Conceptual Design Review •
Facility Document Audit •
Readiness Assessment of Microfab |
|
Gretag Imaging 2000 |
LCD MEMS Optical
Device for High Speed Printing •
Development of CAD Layouts of Device •
Fabrication of Prototypes •
Developed Outsourcing Vendors for Production |
|
Scitex Digital
Printing 1997 |
High Speed Inkjet Printing •
Optimization of Toolset for Scale Up •
Process Flow Analysis •
Metrology Optimization •
Facilities / Safety Audit |
|
Visible Genetics 1997 |
Microcell Array – DNA
Analysis •
Equipment Selection •
Factory Modeling •
Facility Analysis •
Layout •
Yield Enhancement •
Process Scale Up |
|
AIL Systems Division
of Eaton Corp. 1990 – 1991 |
Hi-Rel and Hybrid FAB •
Process analysis •
Factory and tool layout •
FAB, assembly, test for GaAs and
other III-V and Si devices •
Equipment scope: mask making, photolithography, MBE, MOCVD,
etch, alloy, sputter, other metallization, and plating |
|
I-Stat Corp. 1987 – 1990 |
Blood Gas Sensor Start Up •
Medical Sensor Fab, R&D, Assembly •
Building Acquisition •
Complete renovation of 100mm wafer fab, assembly and test |
|
Grumman Space Systems 1989 |
SDI Focal Plane Array •
HgCdTe, CMOS, Hybrid
Technology •
Manufacturing Cost Model |
|
HP |
Inkjet Printing Device Start Up •
Micromachining Process Optimization •
Fab Layout •
SMIF/AMHS Analysis |