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recent projects

AGI Flexible Electronics and Flat Panel Display Projects

Project / Location / Date	Scope of Work
RPO Party, Ltd. Australia 2006	Flexible Substrate Handling Study • Touch screen system for electronics consumer product application • Identification of handling method and potential vendors for multiple process tools
PerkinElmer Optoelectronics (fka EG&G) Santa Clara, CA Sunnyvale, CA 2006 1999 - 2002	Sensor Panel for X-ray Imaging • PECVD Tool Qualification • Capacity Model for Expansion • Audit of Facility for Yield Improvement • Areas of Analysis Included ESD, Contamination, Production Flow, Bottlenecks, and Optimization • Assist with Tool Acquisition / Relocation • Study Tool / Layout / Utility Options for Gen 3-Gen 5 Glass Sizes
Confidential Client San Jose, CA 2005-2006	FPD Start Up Consulting • Facility/Tool Install Design Review • Documentation and training of Fab and Assembly Processes, Facilities, Environmental Health and Safety, and Cleanroom Protocol. • Acceptance testing of process equipment. • Development of materials and supplies requirements. • Capacity Modeling
Confidential Client Asia 2005-2006	Yield Management Study • Yield Management for Gen. 7 FPD • Analysis of pricing trends for TFT, color filter and cell assembly inspection, test and repair equipment • Study of FPD yield enhancement equipment configurations and markets
Power Paper, Ltd 2005-2006	Manufacturability Study of Roll to Roll Process • Electronic product • Evaluation of new equipment lines for automation of high speed production in roll to roll format, 500mm web width.
QSecure, Inc. Palo Alto, CA 2005-2006	Suitable Display Search • Credit card display based on novel security technology • Search for suitable display vendors and technologies to meet banking industry standards for secure credit card transactions
ICL Performance Products (fka Astaris, LLC) Lawrence, KS 2005-2006	Market Research and Manufacturing Facility Feasibility Study • High purity phosphoric acid for FPD wet processing • Training of R&D, product, and marketing teams regarding FPD and Semiconductor processing and market • Feasibility study and budget for ultra clean filtration and dispense plant design
Cabot Corporation Aurora, IL 2005	Market Research and Analysis • FPD Chemical Mechanical Polishing • Study market and applications for polishing in FPD fabrication and assembly
Creo Vancouver, BC 2004-2005	Clean Tool Design • Thermal Imaging for Printing • Clean Tool Design Optimization for Gen 4-7 size tools • Clean Tool Assembly / Crating / Shipping Plan • Tool Construction Evaluation • First 3 tools in the field are being used for large FPD Color Filters in Asia as of January 2006, other applications under development.
DARPA 2004-2005	Macroelectronics Program Technology Viability Review • Review of benchmarks, approximate costs, and likelihood of manufacturing readiness for large area flexible macroelectronics products.
Arizona State University Tempe, AZ 2003 - Present	ASU Flexible Display Center Start Up • Joint venture between Army Research Labs, Arizona State University, and other university / industrial partners • Established need for modeling of flexible display backplane costs based on previous modeling for USDC, Army and Industry needs for flexible backplane foundry • Established tool cost model for 6 inch wafer tools and Gen 2 substrate tools • Developed cost and pricing plan to support  University business model for multi-user Cleanroom  and Company Headquarters type facility • Developed plan for flexible display cost model with 5 to 10 year horizon to support Army program and future foundry for flexible displays
US Display Consortium San Jose, CA 2005-2006	Roll-to-Roll Manufacturing Cost Model for Flexible Displays • Update 2003 study including current industry information on Process Flows, Tools and Materials for large area roll to roll processing.
US Display Consortium San Jose, CA 2002-2003	Roll-to-Roll Manufacturing Cost Model for Flexible Displays • Cost model includes equipment research and layouts for active and passive matrix and OLED/PLEDs. o Process types and their associated capabilities in terms of device dimensions, temperature requirements, throughput rate, and layer-to-layer registration. o Roll-to-Roll tool and handling characteristics important to meet process and production criteria o Tool and equipment types with reasonably established flexible substrate and roll-to-roll capabilities, and their estimated prices o Possible factory layouts and tool groupings for flexible substrate processing, using roll-to-roll processes where possible o Estimated cleanliness in terms of clean class and local minienvironments needed for processing o Estimated cost to create a roll to roll factory for flexible displays with the parameters described above
US Display Consortium San Jose, CA 1998	Horizontal vs. Vertical Flat Panel Processing Study • Cost analysis of transition to vertical material handling. • Cost modeling of transition from generation 3.5 to generation 5 substrates utilizing AGI’s Jupiter^© software.
US Display Consortium San Jose, CA	Commercialization of Factory Planner^TM Software for FPD Factory Simulation and Modeling. • Development of integrated factory planning software, including layout, capacity, automation, and cost of ownership analysis. • Validation of AMLCD and FED factory models. • Includes plate matching analysis.
US Display Consortium San Jose, CA 1994-2002	• 12.1” AMLCD Notebook Display FAB Cost Model • Web Based Processing Team Member • Glass Edge Chipping Equipment Development and Substrate Study. • RFP generation and tool port plate height study. • Participant in material handling worldwide Benchmarking study. • Developed Cost of Ownership Seminar for FPD division of SEMI, presented first in Korea.
Citala Tel-Aviv, Israel 2001	• New Flexible Display Fab • Roll to Roll Processing • Automation Analysis • Programming, Layout, Utility Matrix • Tool Analysis and Selection • Process Analysis • Cost/Factory Model • Benchmark Display Costs • Optimize substrate size
DuPont Displays Santa Barbara, CA 2003	• Cost Model for Flexible Displays
Raytheon Lexington, MA 2002	• Optical Phased Array – 100mm Substrate FPD/IC Process. • Low Volume Factory Model/Cost Analysis. • Operations Relocation Consulting. • Site Selection Analysis.
Eastman Kodak Rochester, NY 1995-2005	• Organic EL Diode • Process Analysis • Cost / Factory Model • Equipment Specification and Procurement • Layout, Facility Design and Construction Engineering Support for R&D and Pilot Line Facility. • Fit up Support Engineering • Process Specification Development and Outsourcing • Color Filter Technology, Process and Cost Analysis • Technology Transfer and Process Engineering Management Support
Dow Chemical Midland, MI 2001	• Display Technology Evaluation • Cost Model • Equipment Analysis and Recommendations • Process Analysis
3M Various US and Canada Locations 1999-2001	• OLEDS, Touch Screens, Polarizers • Process Analysis • Acquisition Evaluations • Factory and Cost Modeling • Mask Design • Substrate Procurement • Facility Layout
Display Sciences North Adams, MA 2000	• MEMS Display/Flexible Substrate • Process Analysis • Factory and Cost Model • DARPA Supported Program
Rockwell Collins Manchester and Cedar Rapids, Iowa 1999-2001	• LCD Post Processing and Ruggedizing • Process, Capacity and Cleanroom Analysis, Layout