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AGI
European Projects
Project /
Location
|
Date
|
Scope of Work
|
|
|
|
|
Ericsson Components
|
1996 – 1999 |
•
BIPOLAR, BiCMOS, CMOS wafer fabs, 0.35 Micron •
Evaluate 150mm conversion of existing wafer fabs. •
Layout optimization. •
Utility matrix development. •
Process optimization and operations turnaround. •
Extensive factory modeling for product mix changes. •
Equipment engineering and maintenance – etch,
photo. |
Littelfuse
|
1996 – 1997 |
•
Thin films fuses. •
Manufacturing technology. •
Wafer fab and Gas discharge TVS acquisition
evaluation: |
General Semiconductor Industries, Inc.
|
1991 – 1992 |
•
Transient Voltage Suppression Devices – Wafers,
Modules, MOV’s. •
Technical Operations Management o
Process, device, product, and equipment engineering, strategic
technology development, quality and reliability (MIL STD, IS0 9000) o
Successful turnaround / sale of company o
First DESC qualified line outside of |
SGS-Thomson
|
1985 |
•
CMOS Wafer Fab. •
Yield Enhancement. •
Contamination Control. •
Training. |
Microchip Technology
|
1995 |
•
200mm wafer submicron CMOS. •
Fab Layout •
Potential fab acquisition evaluation in |
Microelectronic Marin
|
1985-1987 |
•
CMOS Wafer Fab. •
Yield enhancement. •
New fab layout, equipment selection. |