also see our staff bios

recent projects

AGI High Tech Operations and Industrial Engineering Projects

	Project / Location	Date
PerkinElmer Optoelectronics (fka EG&G) Santa Clara, CA Sunnyvale, CA	2006 1999 - 2002	Sensor Panel for X-ray Imaging · PECVD Tool Qualification · Capacity Model for Expansion · Audit of Facility for Yield Improvement · Areas of Analysis Included ESD, Contamination, Production Flow, Bottlenecks, and Optimization · Assist with Tool Acquisition/Relocation
Confidential Client San Jose, CA	2005 – 2006	MEMS Display Start Up Consulting · Facility/Tool Install Design Review · Documentation and training of Fab and Assembly Processes, Facilities, Environmental Health and Safety, and Cleanroom Protocol. · Acceptance testing of process equipment. · Development of materials and supplies requirements. · Capacity Modeling, Front End / Back End
Hologic Newark, DE	2004 – 2005	TFT Panels and Hybrids – Medical Imager · Optimize Process and Equipment for Productivity and Quality · Cleanroom Evaluation / Training · Tool Selection Assistance · Capacity Modeling
Creo Vancouver, BC	2004 – 2005	Thermal Imaging for Printing · Clean Tool Design Optimization · Clean Tool Assembly / Crating / Shipping Plan · Tool Construction Evaluation
Raytheon Lexington, MA	2002 – 2004	Optical Phased Array – 100mm Substrate FPD/IC Process · Low Volume Factory Model/Cost Analysis · Operations Relocation Consulting · Site Selection Analysis
Hynix Semiconductor Korea	2001-2002	Multifab DRAM Operations · Operations and wafer cost review · Technology and wafer size Roadmap audit
Shipley Marlboro, MA	2001	R&D Fab Operations Improvement Plan · Tool Utilization, Scheduling Optimization, Fab Organization and Management Recommendations
Gretag Imaging Rochester, NY	2000	Re-design of LCD Optical Device for High Speed Printing · Development of CAD Layouts of Device · Fabrication of Prototypes · Developed Outsourcing Vendors for Production
Kodak Rochester, NY	1999 – 2005	OLED FPD Pilot Line Ramp Up Optimization · SPC and Operations Systems Development · Process Engineering Leadership – Photolithography · Process Equipment Maintenance and PM Procedure Development
MEMSolutions Ann Arbor, MI Westlake Village, CA	1999 - 2002	MEMS Display Development, Pilot Line · Process Development and Optimization · Process Engineering and Equipment Maintenance
Charles & Colvard Formerly C3, Inc. Raleigh, NC	1999	Silicon Carbide Gemstones (Moissanite) · Wedging Operation Optimization, Tool Capability and Process Analysis · Manufacturing and Cost Analysis
Motorola Chandler, AZ	1997 – 1999	Advanced CMOS, 8” Wafer Fab, 0.35 Micron · Equipment Maintenance: Thin films, Ion Implant, CVD, Metrology
Ericsson Components Stockholm, Sweden	1996 – 1999	BIPOLAR, BiCMOS, CMOS Wafer Fabs, 0.35 Micron · Evaluate 150mm Conversion Of Existing Wafer Fabs · Layout Optimization · Utility Matrix Development · Process Optimization and Operations Turnaround · Extensive Factory Modeling for Product Mix Changes · Equipment Engineering and Maintenance – Etch, Photo
Texas Instruments, formerly Unitrode Merrimack, NH	1997 – 1998	150mm BiCMOS Fab Start Up, 0.6 Micron · Tool Installation and Acceptance · Wafer Process Start-up, Specification Development · Etch, Diffusion, CVD
Colorado Microdisplay Boulder, CO	1997	LCD Microdisplay · Consult on process and automation of wafer and glass based FPD manufacturing, including wafer foundry and LCD assembly process · Consult on manufacturing strategies and management
Seagate Technologies Minneapolis, MN	1997	MR Heads For High Performance Disk Drives · New fab Industrial Engineering · Cycle time reduction · Dispatch rules · Operational audit · Factory modeling recommendations
Littelfuse Des Plaines, IL	1996 - 2002	Thin Film Fuses, TVs, Thyristor Devices · Manufacturing Technology, Technology Transfer · Wafer fab and Gas discharge TVS acquisition evaluation, Fab Audits · Foundry Evaluations
Reedholm Instruments Georgetown, TX	1995	· Test equipment · Wafer level reliability · Equipment marketing
Electronic Data Systems/Winbond Hsinchu, Taiwan, R.O.C.	1995	8” CMOS Wafer Fab Foundry · Fab audit · Information Technology Roadmap development · WIP reduction, cycle time improvement
Advanced Micro Devices Austin, TX	1994	Advanced CMOS Microprocessors, Logic · Course development and training: Parametric Testing, Basic Electronics, Wafer Reliability, Semiconductor Physics and Wafer Sort, Class rating 4.8/5 · Multiple fabs / site training support
GMT Microelectronics Norristown, PN	1993 - 1998	Silicon Wafer Foundry · Business plan development and market analysis · Process equipment maintenance
China Electrical Eng. Design Inst. (CEEDI) Beijing, China Shanghai, China	1992	· Cleanroom consulting · Training · Facility planning · Technology transfer
General Semiconductor Industries, Inc. Tempe, AZ Macroom, Ireland	1991 – 1992	Transient Voltage Suppression Devices – Wafers, Modules, MOV’s · Technical Operations Management · Process, device, product, and equipment engineering, strategic technology development, quality and reliability (MIL STD, ISO 9000) · Successful turnaround / sale of company · First DESC qualified line outside of USA
Commodore Semiconductor Norristown, PN	1989 – 1991	2 micron CMOS DLM · Gate Array Fab / Test · Process Engineering · Yield Enhancement · Manufacturing Management · Contamination Control
Grumman Space Systems Irvine, CA	1989	SDI Focal Plane Array · HgCdTe, CMOS, Hybrid Technology · Manufacturing Cost Model
Lasercom Chatsworth, CA	1987	InP Laser Fab, Assy Test · Process Specification Development · Yield Enhancement
SGS-Thomson Grenoble, France	1985	CMOS Wafer Fab · Yield Enhancement · Contamination Control · Training

Project / Location

Date

Scope of Work

PerkinElmer Optoelectronics

(fka EG&G)

Santa Clara, CA

Sunnyvale, CA

2006

1999 - 2002

Sensor Panel for X-ray Imaging

· PECVD Tool Qualification

· Capacity Model for Expansion

· Audit of Facility for Yield Improvement

· Areas of Analysis Included ESD, Contamination, Production Flow, Bottlenecks, and Optimization

· Assist with Tool Acquisition/Relocation

Confidential Client

San Jose, CA

2005 – 2006

MEMS Display Start Up Consulting

· Facility/Tool Install Design Review

· Documentation and training of Fab and Assembly Processes, Facilities, Environmental Health and Safety, and Cleanroom Protocol.

· Acceptance testing of process equipment.

· Development of materials and supplies requirements.

· Capacity Modeling, Front End / Back End

Hologic

Newark, DE

2004 – 2005

TFT Panels and Hybrids – Medical Imager

· Optimize Process and Equipment for Productivity and Quality

· Cleanroom Evaluation / Training

· Tool Selection Assistance

· Capacity Modeling

Creo

Vancouver, BC

2004 – 2005

Thermal Imaging for Printing

· Clean Tool Design Optimization

· Clean Tool Assembly / Crating / Shipping Plan

· Tool Construction Evaluation

Raytheon

Lexington, MA

2002 – 2004

Optical Phased Array – 100mm Substrate FPD/IC Process

· Low Volume Factory Model/Cost Analysis

· Operations Relocation Consulting

· Site Selection Analysis

Hynix Semiconductor

Korea

2001-2002

Multifab DRAM Operations

· Operations and wafer cost review

· Technology and wafer size Roadmap audit

Shipley

Marlboro, MA

2001

R&D Fab Operations Improvement Plan

· Tool Utilization, Scheduling Optimization, Fab Organization and Management Recommendations

Gretag Imaging

Rochester, NY

2000

Re-design of LCD Optical Device for High Speed Printing

· Development of CAD Layouts of Device

· Fabrication of Prototypes

· Developed Outsourcing Vendors for Production

Kodak

Rochester, NY

1999 – 2005

OLED FPD Pilot Line Ramp Up Optimization

· SPC and Operations Systems Development

· Process Engineering Leadership – Photolithography

· Process Equipment Maintenance and PM Procedure Development

MEMSolutions

Ann Arbor, MI

Westlake Village, CA

1999 - 2002

MEMS Display Development, Pilot Line

· Process Development and Optimization

· Process Engineering and Equipment Maintenance

Charles & Colvard

Formerly C3, Inc.

Raleigh, NC

1999

Silicon Carbide Gemstones (Moissanite)

· Wedging Operation Optimization, Tool Capability and Process Analysis

· Manufacturing and Cost Analysis

Motorola

Chandler, AZ

1997 – 1999

Advanced CMOS, 8” Wafer Fab, 0.35 Micron

· Equipment Maintenance: Thin films, Ion Implant, CVD, Metrology

Ericsson Components

Stockholm, Sweden

1996 – 1999

BIPOLAR, BiCMOS, CMOS Wafer Fabs, 0.35 Micron

· Evaluate 150mm Conversion Of Existing Wafer Fabs

· Layout Optimization

· Utility Matrix Development

· Process Optimization and Operations Turnaround

· Extensive Factory Modeling for Product Mix Changes

· Equipment Engineering and Maintenance – Etch, Photo

Texas Instruments, formerly Unitrode

Merrimack, NH

1997 – 1998

150mm BiCMOS Fab Start Up, 0.6 Micron

· Tool Installation and Acceptance

· Wafer Process Start-up, Specification Development

· Etch, Diffusion, CVD

Colorado Microdisplay

Boulder, CO

1997

LCD Microdisplay

· Consult on process and automation of wafer and glass based FPD manufacturing, including wafer foundry and LCD assembly process

· Consult on manufacturing strategies and management

Seagate Technologies

Minneapolis, MN

1997

MR Heads For High Performance Disk Drives

· New fab Industrial Engineering

· Cycle time reduction

· Dispatch rules

· Operational audit

· Factory modeling recommendations

Littelfuse

Des Plaines, IL

1996 - 2002

Thin Film Fuses, TVs, Thyristor Devices

· Manufacturing Technology, Technology Transfer

· Wafer fab and Gas discharge TVS acquisition evaluation, Fab Audits

· Foundry Evaluations

Reedholm Instruments

Georgetown, TX

1995

· Test equipment

· Wafer level reliability

· Equipment marketing

Electronic Data Systems/Winbond

Hsinchu, Taiwan, R.O.C.

1995

8” CMOS Wafer Fab Foundry

· Fab audit

· Information Technology Roadmap development

· WIP reduction, cycle time improvement

Advanced Micro Devices

Austin, TX

1994

Advanced CMOS Microprocessors, Logic

· Course development and training: Parametric Testing, Basic Electronics, Wafer Reliability, Semiconductor Physics and Wafer Sort, Class rating 4.8/5

· Multiple fabs / site training support

GMT Microelectronics

Norristown, PN

1993 - 1998

Silicon Wafer Foundry

· Business plan development and market analysis

· Process equipment maintenance

China Electrical Eng. Design Inst. (CEEDI)

Beijing, China

Shanghai, China

1992

· Cleanroom consulting

· Training

· Facility planning

· Technology transfer

General Semiconductor Industries, Inc.

Tempe, AZ

Macroom, Ireland

1991 – 1992

Transient Voltage Suppression Devices – Wafers, Modules, MOV’s

· Technical Operations Management

· Process, device, product, and equipment engineering, strategic technology development, quality and reliability (MIL STD, ISO 9000)

· Successful turnaround / sale of company

· First DESC qualified line outside of USA

Commodore Semiconductor

Norristown, PN

1989 – 1991

2 micron CMOS DLM

· Gate Array Fab / Test

· Process Engineering

· Yield Enhancement

· Manufacturing Management

· Contamination Control

Grumman Space Systems

Irvine, CA

1989

SDI Focal Plane Array

· HgCdTe, CMOS, Hybrid Technology

· Manufacturing Cost Model

Lasercom

Chatsworth, CA

1987

InP Laser Fab, Assy Test

· Process Specification Development

· Yield Enhancement

SGS-Thomson

Grenoble, France

1985

CMOS Wafer Fab

· Yield Enhancement

· Contamination Control

· Training

AGI Abbie Gregg, Inc. | Engineering | Consulting | Helping the world turn technology into products.

1130 E. University Drive Suite 105 | Tempe, AZ 85281 USA | Phone: 480-446-8000 | Fax: 480-446-8001 | www.abbiegregg.com