also see our staff
bios
recent projects
AGI
Equipment Engineering and Maintenance Projects
Project /
Location / Date
|
Scope of Work
|
|
|
|
|
Energy Conversion Devices (ECD) 2005 |
Solar Cell Roll to Roll Stainless Steel Processing Equip ·
Provided consulting to optimize film etch back technologies, processes, and tool cleanliness
following multiday runs |
|
Creo 2004 – 2005 |
Thermal Imaging for Printing (LITI) ·
Clean Tool Design Optimization ·
Clean tool Assembly / Crating / Shipping Plan ·
Toll Construction Evaluation ·
First 3 tools in the field are being used for large FPD
Color Filters in |
|
Flexible 2003 – Present |
Flexible Display Research, Develop ·
Assisted Develop ·
Developed Tool List, 6-inch and Gen II ·
Building Evaluation (Facilities Infrastructure) and
Utilization Plan ·
Cleanroom Audit ·
On-site Operations and Start-up Support ·
Tool Installation Design and Supervision ·
Facility Reconfiguration Support |
|
Bourns Hall Cleanroom 2003 – 2005 |
Center for Nanoscale Science
and Engineering ·
Cleanroom and Characterization Programming, Design, and
Construction Support (Design-Build Project) ·
E-Beam Lithography ·
Layout, Utility Matrix, HPM Analysis ·
Tool Research and Negotiation ·
Vibration and EMI Consulting and Abatement Recommendations ·
Process Engineering Support for the Tool Evaluation,
Acceptance and Start-up |
|
2002 – Present |
·
Cleanroom Design: Program through Construction Docu ·
Nanotechnology and Bio Cleanroom, Characterization, and MBE ·
Class 10 to class 1,000 ·
Layout, Utility Matrix, HPM Analysis ·
Tool Research ·
Vibration and EMI Consulting and Abatement ·
Accommodate Relocated and New Tools |
|
2002 – Present |
SSEL Cleanroom Expansion, Steve Forrest Labs ·
Cleanroom Design: Programming through Construction Docu ·
Layout (As Built and Proposed Expansion) ·
Utility Matrix ·
Specialty Systems and HVAC Consulting ·
HPM Analysis ·
Tool Installation Design ·
Relocation of OLED, Display, and MBE custom tools from
Princeton to |
|
Knowles Electronics 2000 – 2002 |
Equip ·
Evaporator Maintenance ·
Roll to Roll Deposition Equipment Optimization ·
4 inch Wafer Fab Tool Maintenance |
|
Fanuc 2002 |
Facilities Decommission ·
Dismantle 2,000 square foot Cleanroom and Facilities Support
Space ·
Environmental Decontamination |
|
2002 |
CITRIS Cleanroom Tool De-installation ·
Relocate and De-install, Wrap, Crate, and Ship to 40 MEMS Process
Tools to be donated from FANUC to ·
Coordinate Delivery to multiple |
|
Hunt Construction/ Delphi Automotive/ 2001 |
Tool De-Installation/Relocation ·
De-install, Wrap, and Crate 100 Process Tools to Support CMOS
Process Transfer from Delphi to |
|
Motorola 2000 |
Nikon Stepper and FAS Coat Develop System
De-installation ·
Remove Large Substrate FPD Stepper and Extrusion/Spin
Coat/Develop Tools from Cleanroom ·
Document Equipment Disassembly |
|
1999 |
·
Invented and Constructed Glass Edge Chipping Test Apparatus ·
Evaluated wide range of impact materials and glass attributes
with standard test |
Motorola MOS 12
1997 – 2001 |
Advanced ·
Thinfilms, Ion Implant, CVD,
and Metrology Equipment Maintenance (Applied Materials, Eaton, Varian, etc.) |
|
MEMSolutions 1999 – 2002 |
FPD Pilot Line (MEMS) ·
Process and equipment maintenance for Thinfilm
deposition equipment |
|
Acoustic Imaging 1999 |
Medical Transducer Manufacturer ·
Analysis and Training to improve Sputter Equipment performance |
|
Kodak 1998 – 1999 |
FPD Pilot Line (OLED) ·
Equipment maintenance, preventive maintenance specification
development and training for Photo, Etch, and Strip/Clean equipment set. New and used tools |
|
(fka Unitrode) 1997 – 1998 |
150mm BiCMOS Fab Start Up, 0.6
Micron ·
Tool installation and acceptance ·
Wafer process start-up, specification development ·
Etch, Diffusion, |
|
1997 – 1998 |
125mm Wafer Fab ·
Photolithography, Etch, |
|
Ericsson Components 1996 – 1998 |
100mm Wafer Fab ·
Etch, Photolithography Equip |
|
Optical Imaging Systems 1993 |
FPD (320mm x 340mm
AMLCD) Fab ·
Equip |
|
General Semiconductor
Industries, Inc. 1991 – 1992 |
Transient Voltage Suppression Devices
– Wafers, Modules, ·
Technical Operations Manage ·
Process, device, product, and equip ·
Successful turnaround / sale of company ·
First DESC qualified line outside of |